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Applications Of Experimental Mechanics To Electronic Packaging: Presented At The 1995 Asme International Mechanical Engineering Congress And Exposition, November 12 17, 1995, San Francisco, California - J. C. Suhling
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Applications Of Experimental Mechanics To Electronic Packaging: Presented At The 1995 Asme International Mechanical Engineering Congress And Exposition, November 12 17, 1995, San Francisco, California
by: (author)
Format: hardcover
ISBN: 9780791817391 (0791817393)
Pages no: 124
Edition language: English
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Books by J. C. Suhling
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