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Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing - Sheng Liu, Yong Liu
Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing
by: (author) (author)
Format: kindle
ASIN: B006G273M4
Publisher: Wiley
Pages no: 576
Edition language: English
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Other editions (5)
Books by Yong Liu
Books by Sheng Liu
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