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Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic Research and Development in Japan - K. Otsuka
Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic Research and Development in Japan
by: (author)
Format: hardcover
ISBN: 9781851665792 (185166579X)
Publisher: Springer
Pages no: 256
Edition language: English
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Books by K. Otsuka
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