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Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling - Yong Liu
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling
by: (author)
Format: kindle
ASIN: B00A9YG57E
Publisher: Springer
Pages no: 612
Edition language: English
Bookstores:
Other editions (1)
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling - Yong Liu
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Computational Intelligence and Intelligent Systems: 4th International Symposium on Intelligence Computation and Applications, Isica 2009, Huangshi, China, October 23-25, 2009 - Zhihua Cai, Zhenhua Li, Zhuo Kang, Yong Liu
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Advances in Computation and Intelligence: Third International Symposium on Intelligence Computation and Applications, Isica 2008 Wuhan, China, December 19-21, 2008 Proceedings - Lishan Kang, Zhihua Cai, Yong Liu, Xuesong Yan
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Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling - Yong Liu
Evolvable Systems: From Biology to Hardware: 7th International Conference, ICES 2007, Wuhan, China, September 21-23, 2007, Proceedings (Lecture Notes in ... Computer Science and General Issues) - Lishan Kang, Yong Liu, Sanyou Zeng
Advances in Computation and Intelligence: Second International Symposium, ISICA 2007 Wuhan, China, September 21-23, 2007 Proceedings - Lishan Kang, Yong Liu, Sanyou Zeng
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