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Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling - editions back

by Yong Liu
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Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling - Yong Liu
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling
publisher: Springer publish date: February 15th 2012
format: kindle pages: 612
language: English
ASIN: B00A9YG57E
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling - Yong Liu
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling
publisher: Springer publish date: February 17th 2012
format: hardcover pages: 612
language: English
ISBN: 1461410525 (9781461410522)
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