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Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling - Yong Liu
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling
by: (author)
Format: hardcover
ISBN: 9781461410522 (1461410525)
Publisher: Springer
Pages no: 612
Edition language: English
Bookstores:
Other editions (1)
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling - Yong Liu
Books by Yong Liu
The Dutch East India Company's Tea Trade with China, 1757-1781 - Yong Liu
Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing - Sheng Liu, Yong Liu
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Quality of Service in Optical Burst Switched Networks (Optical Networks) - Kee Chaing Chua, Mohan Gurusamy, Yong Liu, Minh Hoang Phung
Computational Intelligence and Intelligent Systems: 4th International Symposium on Intelligence Computation and Applications, Isica 2009, Huangshi, China, October 23-25, 2009 - Zhihua Cai, Zhenhua Li, Zhuo Kang, Yong Liu
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Quality of Service in Optical Burst Swit... Quality of Service in Optical Burst Switched Networks - Kee Chiang Chua, Mohan Gurusamy, Yong Liu, Minh Hoang Phung
Advances in Computation and Intelligence: Third International Symposium on Intelligence Computation and Applications, Isica 2008 Wuhan, China, December 19-21, 2008 Proceedings - Lishan Kang, Zhihua Cai, Yong Liu, Xuesong Yan
Evolvable Systems: From Biology to Hardware: 4th International Conference, Ices 2001 Tokyo, Japan, October 3-5, 2001 Proceedings - Yong Liu, Tetsuya Higuchi, Masaya Iwata, Kiyoshi Tanaka, Yasunaga, Moritoshi
Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling - Yong Liu
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