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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages - Gerard Kelly
The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages
by: (author)
Format: paperback
ISBN: 9781461372769 (1461372763)
Publisher: Springer
Pages no: 134
Edition language: English
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Books by Gerard Kelly
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