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Application Of Fracture Mechanics In Electronic Packaging And Materials: Presented At The 1995 Asme International Mechanical Engineering Congress And Exposition, November 12 17, 1995, San Francisco, California - American Society of Mechanical Engineers, Tien Y. Wu
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Application Of Fracture Mechanics In Electronic Packaging And Materials: Presented At The 1995 Asme International Mechanical Engineering Congress And Exposition, November 12 17, 1995, San Francisco, California
by: (author) (author)
Format: hardcover
ISBN: 9780791817360 (0791817369)
Edition language: English
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