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Mechanics and Materials for Electronic Packaging: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, N - American Society of Mechanical Engineers
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Mechanics and Materials for Electronic Packaging: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, N
Format: paperback
ISBN: 9780791814420 (0791814424)
Pages no: 3
Edition language: English
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Other editions (1)
Books by American Society of Mechanical Engineers
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