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Mechanics and Materials for Electronic Packaging: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, N (Eep) - American Society of Mechanical Engineers
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Mechanics and Materials for Electronic Packaging: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, N (Eep)
by: (author)
Format: paperback
ISBN: 9780791814499 (0791814491)
Publisher: American Society of Mechanical Engineers
Pages no: 3
Edition language: English
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Other editions (1)
Mechanics and Materials for Electronic P... Mechanics and Materials for Electronic Packaging: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, N - American Society of Mechanical Engineers
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