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Stress Management for 3D ICS Using Through Silicon Vias:: International Workshop on Stress Management for 3D ICS Using Through Silicon Vias - Ehrenfried Zschech, Riko Radojcic, Valeriy Sukharev
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Stress Management for 3D ICS Using Through Silicon Vias:: International Workshop on Stress Management for 3D ICS Using Through Silicon Vias
by: (author) (author) (author)
Format: paperback
ISBN: 9780735409385 (0735409382)
Publisher: American Institute of Physics
Pages no: 182
Edition language: English
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Books by Ehrenfried Zschech
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Stress Management for 3D ICS Using Throu... Stress Management for 3D ICS Using Through Silicon Vias:: International Workshop on Stress Management for 3D ICS Using Through Silicon Vias - Ehrenfried Zschech, Riko Radojcic, Valeriy Sukharev
Materials for Information Technology: Devices, Interconnects and Packaging - Ehrenfried Zschech, Caroline Whelan, Thomas Mikolajick
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Books by Riko Radojcic
Three Dimensional System Integration - Antonis Papanikolaou, Dimitrios Soudris, Riko Radojcic
Stress Management for 3D ICS Using Throu... Stress Management for 3D ICS Using Through Silicon Vias:: International Workshop on Stress Management for 3D ICS Using Through Silicon Vias - Ehrenfried Zschech, Riko Radojcic, Valeriy Sukharev
Books by Valeriy Sukharev
Stress Management for 3D ICS Using Throu... Stress Management for 3D ICS Using Through Silicon Vias:: International Workshop on Stress Management for 3D ICS Using Through Silicon Vias - Ehrenfried Zschech, Riko Radojcic, Valeriy Sukharev
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