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Mechanics and Materials for Electronic Packaging: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, N (Eep) - editions back

by American Society of Mechanical Engineers
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Mechanics and Materials for Electronic Packaging: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, N - American Society of Mechanical Engineers
Mechanics and Materials for Electronic Packaging: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, N
by American Society of Mechanical Engineers (author)
format: paperback pages: 3
language: English
ISBN: 0791814424 (9780791814420)
Mechanics and Materials for Electronic Packaging: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, N (Eep) - American Society of Mechanical Engineers
Mechanics and Materials for Electronic Packaging: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, N (Eep)
by American Society of Mechanical Engineers (author)
publisher: American Society of Mechanical Engineers publish date: January 29th 1994
format: paperback pages: 3
language: English
ISBN: 0791814491 (9780791814499)
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