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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs - Brandon Noia, Krishnendu Chakrabarty
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
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Format: kindle
ASIN: B00GPG8T88
Publisher: Springer
Pages no: 274
Edition language: English
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Books by Krishnendu Chakrabarty
Books by Brandon Noia
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